NPTEL Lecture : 'Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages'

Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages

  • Course: An Introduction to Electronics Systems Packaging
  • Discipline: Electrical Engineering
  • Faculty: Prof. G.V. Mahesh
  • Institute: IISc Bangalore
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    Course: An Introduction to Electronics Systems Packaging
    Discipline: Electrical Engineering
    Institute: IISc Bangalore
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