An Introduction to Electronics Systems Packaging Video Lectures

An Intro to Electronics Systems Packaging
'An Introduction to Electronics Systems Packaging' Video Lectures by Prof. G.V. Mahesh from IISc Bangalore
"An Intro to Electronics Systems Packaging" - Video Lectures
1. Introduction and Objectives of the course
2. Definition of a system and history of semiconductors
3. Products and levels of packaging
4. Packaging aspects of handheld products; Case studies in applications
5. Case Study (continued); Definition of PWB, summary and Questions for review
6. Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon”
7. Wafer fabrication, inspection and testing
8. Wafer packaging; Packaging evolution; Chip connection choices
9. Wire bonding, TAB and flipchip-1
10. Wire bonding, TAB and flipchip-2; Tutorials
11. Why packaging? & Single chip packages or modules (SCM)
12. Commonly used packages and advanced packages; Materials in packages
13. Advances packages (continued); Thermal mismatch in packages; Current trends in packaging
14. Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages
15. Electrical Issues - I; Resistive Parasitic
16. Electrical Issues - II; Capacitive and Inductive Parasitic
17. Electrical Issues - III; Layout guidelines and the Reflection problem
18. Electrical Issues - IV; Interconnection
19. Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT
20. Components of a CAD package and its highlights
21. Design Flow considerations; Beginning a circuit design with schematic work and component layout
22. Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability
23. Review of CAD output files for PCB fabrication; Photo plotting and mask generation
24. Process flow-chart; Vias; PWB substrates
25. Substrates continued; Video highlights; Surface preparation
26. Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs
27. PWB etching; Resist stripping; Screen-printing technology
28. Through-hole manufacture process steps; Panel and pattern plating methods
29. Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias
30. Microvia technology and Sequential build-up technology process flow for high-density interconnects
31. Conventional Vs HDI technologies; Flexible circuits; Tutorial session
32. SMD benefits; Design issues; Introduction to soldering
33. Reflow and Wave Soldering methods to attach SMDs
34. Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
35. Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures
36. SMT failure library and Tin Whiskers
37. Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys
38. Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues
39. Thermal Design considerations in systems packaging
40. Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes
41. Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging
42. Chapter-wise summary
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